Here's the Samsung Galaxy S 4G PCB board which shows the components and IC's mounted or used in the circuit. The major IC's used were labeled as a reference and familiarization of the entire PCB board layout.
Samsung Galaxy S 4G front PCB Motherboard IC Components:
Maxim MAX8987 DC Power Management
Samsung KB100L00WM-A453 4Gb (512 MB) of mobile DRAM which contains a 1 GHz Intrinsity Processor in a package-on-package configuration, according to the fine folks at
ST Ericsson's THOR M5730 HSPA+ Thin Modem
ST Ericsson GNS7560 Single Chip GPS Solution
Bosch Sensortec Accelerometer
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Samsung Galaxy S 4G Back PCB Motherboard IC Components:
Broadcom
BCM4329 802.11n Wi-Fi, Bluetooth 2.1, and FM Tuner
ST Ericsson RF5000 Radio Transceiver (part of THOR M570 chipset)
Wolfson Microelectronics
WM8994 Audio CODEC
Skyworks
SKY77447 Load Insensitive Power Amplifier for WCDMA / HSDPA / HSUPA / HSPA+ Band II
Skyworks
SKY77544 TX-RX Front End Module
Skyworks
SKY77460 WCDMA/HSPA+ Power Amplifier
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The Samsung Galaxy S 4G compact front and rear camera assembly flex board.
It uses a NEC
MC10170 Image Processor cleverly mounted right to its ribbon cable.
The
Samsung Galaxy S 4G headphone jack, earpiece speaker, and proximity/ambient light sensors Flex cable.
Back of the display assembly mounted the Atmel
mXT 224 touchscreen controller.
The removed button capacitive touch sensors, vibrator unit, lower microphone, and antenna cable connector mounted on the same flex assembly.
There you have it the labeled Samsung Galaxy S 4G PCB Board, That's all folks!
