Samsung ZV50 Service Manual / Wiring Diagram / Schematic Diagram

This is the service manual of Samsung ZV50  mobile phone., used by mobile phone technician for repair and troubleshooting hardware problems like:
1.Samsung ZV50 LCD replacement
2.Samsung ZV50 Display problem
3.Samsung ZV50 keypad problem
4.Samsung ZV50 Not charging,
5.Samsung ZV50 Backlight LED problem,
6.Samsung ZV50 Earpiece problem
7.Samsung ZV50 Microphone problem
8.Samsung ZV50 Buzzer speaker problem
9.Samsung ZV50 No network problem
10.Samsung ZV50 Bluetooth problem

The Samsung ZV60 Service Manual table of contents:

   1. Safety Precautions
   2. Specification
   3. Operation Instruction and Installation
   4. Array course control
   5. Exploded View/Disassembly and Assembly Instructions
   6. MAIN Electrical Parts List
   7. Block Diagrams
   8. PCB Diagrams / Wiring Diagram / Schematic Diagram
   9. Flow Chart of Troubleshooting
  10. Reference data

Download Samsung ZV50 Service Manual

1. Safety Precautions
1-1. Repair Precaution
Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because specipicty of cellular phone is sensitive for surrounding interference(RF noise). Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of magnetic force. Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away. Use a thicken twisted wire when you measure level. A thicken twisted wire has low resistance, therefore error of measurement is few. Repair after separate Test Pack and Set because for short danger (for example an overcurrent and furious flames of parts etc) when you repair board in condition of connecting Test Pack and tuning on. Take specially care of soldering, because Land of PCB is small and weak in heat. Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous when tuning ON/OFF PBA and Connector after disassembling charger. Don't use as you pleases after c
hange other material than replacement registered on SEC System. Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Safety Precautions

1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD (Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity. Remove static electricity remained your body before you touch semiconductor or parts with semiconductor. There are ways that you touch an earthed place or wear static electricity prevention string on wrist. Use earthed soldering steel when you connect or disconnect ESD. Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by static electricity. Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum plate to have conductive power,they are prevented from static electricity. You must maintain electric contact between ESD and place due to be set up until ESD is connected completely to the proper place or a circuit board.

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SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

2. Specification
2-1. GSM General Specification
EG SM 900 Fr eq. Band [MHz] Up link/ Do wnl ink ARFCN ran ge Tx/Rx spacin g Mod . Bit r ate/ Bi t Peri od Tim e Slot Per iod/ Fra me Per iod GSM/ G PR S Modu lation EDG E MS Power Po wer Class Sen sitivity TDMA M ux Cell Radius 8PSK 8PSK 8PSK 2 4dBm ~ - 50dBm 3 (max +24dBm) - 106.7 dBm 880~9 15 925~9 60 0~1 24 & 975~1 023 45MHz 270.8 33kbps 3.69 2us 576. 9us 4 .615ms 0.3G MSK DCS1 800 1710~1 785 1805~1 880 512~8 85 95MHz 270.8 33kbps 3.69 2us 576. 9us 4 .615ms 0.3G M SK PCS1 900 1850~1 910 1930~1 990 512~8 10 80MHz 270.8 33kbps 3.69 2us 576. 9us 4 .615ms 0.3G MSK QPSK HQPSK W- CDMA 1 920~19 80 2 110~21 70 UL:9 612~98 88 DL:10 562~10 838 190MHz 3. 84Mcps

F rame l ength : 10ms Slot lengt h : 0. 667ms

33dBm~ 5dBm 30dBm~ 0dBm 30dBm~ 0dBm 4 (max +33dBm) - 102dBm 8 35Km 1 (max +30dBm) - 100dBm 8 2Km 1 (max +30dBm) - 100dBm 8 2Km